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Mitigate Tin Whisker Formation with Tin Reflow

reflow plating serviceTin whiskers are electrically conductive, crystalline structures of tin that often grow perpendicular to surfaces of electroplated tin.

Tin whiskers can be caused by internal stresses created during the electroplating process and have caused short circuits responsible for numerous electronic system failures.

The incorporation of lead in the deposit has been the traditional solution to tin whisker formation; with RoHs compliance regulations requiring the removal of lead from most tin plating applications, the problem of tin whisker formation required new solutions.

Precious Plate reduces tin whiskers with tin reflow

We offer a tin reflow process that can mitigate tin whisker formation for applications such as telecommunications connectors, aerospace, avionics, automotive sensor systems, and numerous other extremely compact devices where tin whisker growth poses a potential shorting risk. 

How the tin reflow plating process works

After being plated with tin, continuous coil-stock or stamped parts are run through a reflow chamber where the tin is heated to its melting point and then cooled. This procedure relieves the internal stresses within the tin deposit that can be responsible for whisker growth. Precious Plate, in conjunction with its sister company, Precision Process Inc., have developed state-of-the-art equipment to ensure the highest possible consistency and efficiency during the tin reflow process.

The benefits of tin reflow plating

  • Mitigation of tin whiskers
  • Improved solderability
  • Reduced insertion force
  • Excellent formability during stamping

Contact us to discuss your custom industrial tin reflow plating project today!